
This write-up was longer than I anticipated, but I think it says everything I want it to:
http://therealundamned.blogspot.com/200 ... -rrod.html
-ud
i'll be that guy. my first 360 died. i did the x-clamp mod and 3 months later it died again. luckily it seems the newer 360's don't have the heat related issues. but my dvd-rom drive is starting to get real fussy with loading discs....robivy64 wrote:The x-clamp mod is a temporary fix to a much bigger problem. All you are doing is forcing the cracked BGA connections together until new ones form. You only read about the x-clamp mod working because nobody follows up with a "my system just stopped working again" post.
It's like putting a band-aid on a shark bite.
You just remove everything from the chassis and have at itdmauro wrote:Could you give some more details on how exactly you drilled away the part of the chassis that was in the way? I don't suppose you have photos of the process?
No, the x-clamp fix is bad in a different wayDAY wrote:So, if I read this correctly, the xclamp fix is just pushing everything together and because it still is fixed to the mobo, therefore still as ineffective as the original solution?
In drilling out the holes, we are not so much releasing tension (we need it!), we are allowing the tension to not be thrown off by other parts. When it is cut free, the x-clamps are able to apply tension uniformly and no longer have to battle against the metal chassis. The washers merely hold the clamps on, as the screw heads are not big enough w/o the support of the chassis (which has been drilled out!).DAY wrote:I understand that with drilling out hte holes, the tension is released, but what prevents it from falling off? I don't really understand the washers bit. Can you please help me out with some WIP pics? Thanks in advance.
The design flaw I was referring to was the poor mounting of the heat sink (i.e. the flaw covered in my article). There are any number of other flaws w/ the design of the 360 I did not coverrobivy64 wrote:The design flaw is the GPU's BGA solder joints expanding and contracting drastically due to excessive heat.
Thank you!DAY wrote:Thx undamned, the second picture really helps. I can now see how you drilled it it out and how the xclamp is fixed now. My holiday is over two weeks. When I do my attempt I will make WIP pictures en stick them on this thread.
RegalSin wrote:Street Fighters. We need to aviod them when we activate time accellerator.
You might be able to get away without using the washers, but you are still not doing anything to prevent the x-clamps from touching the chassis. Any pressure from the chassis is bad and without drilling those areas out, you cannot guarantee nothing is touching.Casey120 wrote:Cant you just remove the 8 screws under the chassis and not drill and use washers ?
The X-clamp is very tight on the motherboard and hard to remove so the risk of a clamp getting lose is not very likely .
undamned wrote:You might be able to get away without using the washers, but you are still not doing anything to prevent the x-clamps from touching the chassis. Any pressure from the chassis is bad and without drilling those areas out, you cannot guarantee nothing is touching.Casey120 wrote:Cant you just remove the 8 screws under the chassis and not drill and use washers ?
The X-clamp is very tight on the motherboard and hard to remove so the risk of a clamp getting lose is not very likely .
-ud
Hope you don't knock it over though. Or any pet/baby/drunk friend knocking it over. I have mine in a shelf I built inside my EGRET II. Laying flat. As heat travels upward, isn't having it standing up exposing it to more heat?dmauro wrote:I'm just going to try to mitigate any heat problems as best I can without opening the console, and hope that I can send it to MS for repair when it RRODs, since I'm in the US. Here's how I've got it set up now:
Propped up so all sides of the console are exposed.
RegalSin wrote:Street Fighters. We need to aviod them when we activate time accellerator.
I think a GPU would most likely crash or throttle well under the ~200C temps needed to actually melt common electronics solders. The only serious hypothesis I've seen in terms of heat ruining solder joints in the 360 is that thermal expansion/contraction might exert enough force to break some marginal joints.undamned wrote:these GPU's can get hot enough to MELT SOLDER